ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,641, issued on Aug. 11, was assigned to Micron Technology Inc. (Boise, Idaho). "Page buffer for memory devices" was invented by Md Zahid Ho... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,642, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor memory devices and me... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,643, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Three dimensional semiconductor device an... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,644, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Three-dimensional memory device wit... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,645, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "3D ferroelectric memory devices" was invente... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,646, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Memory device and electronic device inclu... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,647, issued on Aug. 11, was assigned to Micron Technology Inc. (Boise, Idaho). "Array of capacitors, an array of memory cells, method used ... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,648, issued on Aug. 11, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Bit-line resistance reduction" was ... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,649, issued on Aug. 11, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Stacked 3D cache configuration with on-chip ... Read More
ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,650, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Package structure and method fo... Read More